3D Microelectronic Packaging

Editora: Springer International Publishing Data de lançamento: 2017-01-20
Pontos Requerido: 52800


Descrição

This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development.

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Informação Adicional

Gênero: Precision instruments manufacture

Coleção: Springer

Typo: Adobe PDF

ISBN: 9783319445861

Informação Adicional

Gênero: Precision instruments manufacture

Coleção: Springer

Typo: Adobe PDF

ISBN: 9783319445861

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